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IMOS – Chipmos Technologies Inc ADR

Float Short %

0.09

Margin Of Safety %

Put/Call OI Ratio

1.76

EPS Next Q Diff

EPS Last/This Y

EPS This/Next Y

Price

29.11

Target Price

29.32

Analyst Recom

1

Performance Q

63.24

Relative Volume

2.72

Beta

1.06

Ticker: IMOS




19 items of 1

DateSymbolLatestP/C OIP/C VolTotal OI
2025-11-10IMOS22.20.870.00455
2025-11-11IMOS22.110.900.00447
2025-11-12IMOS25.420.941.38448
2025-11-13IMOS27.70320.960.63466
2025-11-14IMOS30.70.970.00468
2025-11-17IMOS28.730.940.21474
2025-11-18IMOS29.420.940.21474
2025-11-19IMOS29.66950.920.00487
2025-11-20IMOS29.30.850.50506
2025-11-21IMOS28.30.850.40506
2025-11-24IMOS27.480.850.40506
2025-11-25IMOS27.721.01999.99521
2025-11-26IMOS27.111.3476.00605
2025-12-01IMOS26.961.63999.99681
2025-12-02IMOS27.96251.760.00715
2025-12-03IMOS28.051.76999.99715
2025-12-04IMOS27.971.76999.99715
2025-12-05IMOS27.971.76999.99715
2025-12-08IMOS29.141.76999.99715
DateSymbolLatestP/C OIP/C VolTotal OI
19 items Current Page1 of 1




19 items of 1

DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
2025-11-10IMOS22.48- - -
2025-11-11IMOS22.10- - -
2025-11-12IMOS25.40- - -
2025-11-13IMOS27.77- - -
2025-11-14IMOS30.76- - -
2025-11-17IMOS28.73- - -
2025-11-18IMOS29.33- - -
2025-11-19IMOS29.79- - -
2025-11-20IMOS29.16- - -
2025-11-21IMOS28.24- - -
2025-11-24IMOS27.40- - -
2025-11-25IMOS27.92- - -
2025-11-26IMOS26.87- - -
2025-12-01IMOS26.96- - -
2025-12-02IMOS28.03- - -
2025-12-03IMOS28.21- - -
2025-12-04IMOS27.91- - -
2025-12-05IMOS27.97- - -
2025-12-08IMOS29.11- - -
DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
19 items Current Page1 of 1




19 items of 1

DateTickerInsider TransactionsInstitutional TransactionsFloat Short
2025-11-10IMOS0-10.260.06
2025-11-11IMOS0-10.260.06
2025-11-12IMOS0-10.260.09
2025-11-13IMOS0-10.260.09
2025-11-14IMOS0-10.260.09
2025-11-17IMOS0-7.270.09
2025-11-18IMOS0-7.270.09
2025-11-19IMOS0-7.270.09
2025-11-20IMOS0-7.270.09
2025-11-21IMOS0-7.270.09
2025-11-24IMOS0-6.770.09
2025-11-25IMOS0-6.770.09
2025-11-26IMOS0-6.770.09
2025-12-01IMOS0.00-11.600.09
2025-12-02IMOS0.00-11.600.09
2025-12-03IMOS0-11.600.09
2025-12-04IMOS0-11.600.09
2025-12-05IMOS0-11.600.09
2025-12-08IMOS0-11.820.09
DateTickerInsider TransactionsInstitutional TransactionsFloat Short
19 items Current Page1 of 1

Last Quarter Act. EPS

Avg. EPS Est. Current Quarter

Avg. EPS Est. Next Quarter

Insider Transactions

Institutional Transactions

-11.82

Beta

1.06

Average Sales Estimate Current Quarter

5893

Average Sales Estimate Next Quarter

5925

Fair Value

Quality Score

68

Growth Score

88

Sentiment Score

92

Actual DrawDown %

34.9

Max Drawdown 5-Year %

-62.4

Target Price

29.32

P/E

140.7

Forward P/E

16.52

PEG

11.73

P/S

1.38

P/B

1.33

P/Free Cash Flow

EPS

0.21

Average EPS Est. Cur. Y​

EPS Next Y. (Est.)

Target Price Estimates Raised

Target Price Estimates Lowered

Profit Margin

1.05

Relative Volume

2.72

Return on Equity vs Sector %

-46.9

Return on Equity vs Industry %

-52.5

EPS 1 7Days Diff

EPS 1 30Days Diff

EBIT Estimation

ChipMOS TECHNOLOGIES INC.
Sector: Technology
Industry: Semiconductors
Employees:
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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