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AMKR – Amkor Technology, Inc.

Float Short %

8.88

Margin Of Safety %

-8

Put/Call OI Ratio

0.52

EPS Next Q Diff

-0.29

EPS Last/This Y

-0.19

EPS This/Next Y

0.43

Price

44.71

Target Price

36.44

Analyst Recom

2.29

Performance Q

79.77

Relative Volume

1.12

Beta

1.99

Ticker: AMKR




19 items of 1

DateSymbolLatestP/C OIP/C VolTotal OI
2025-11-10AMKR35.210.550.21145412
2025-11-11AMKR34.260.550.19146116
2025-11-12AMKR34.430.560.16146274
2025-11-13AMKR31.950.564.03146219
2025-11-14AMKR31.690.720.23161426
2025-11-17AMKR30.890.720.09161540
2025-11-18AMKR30.720.730.21161267
2025-11-19AMKR31.430.720.12161325
2025-11-20AMKR30.160.720.26162470
2025-11-21AMKR32.350.710.43162189
2025-11-24AMKR33.140.860.15136248
2025-11-25AMKR33.810.860.17137216
2025-11-26AMKR34.920.850.20137992
2025-12-01AMKR37.770.870.19140422
2025-12-02AMKR40.650.850.20142863
2025-12-03AMKR43.930.880.05143546
2025-12-04AMKR43.20.830.16149664
2025-12-05AMKR43.230.960.19171171
2025-12-08AMKR44.720.520.22133095
DateSymbolLatestP/C OIP/C VolTotal OI
19 items Current Page1 of 1




19 items of 1

DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
2025-11-10AMKR35.211.5103.11.25
2025-11-11AMKR34.261.580.41.25
2025-11-12AMKR34.471.599.41.25
2025-11-13AMKR31.961.554.01.25
2025-11-14AMKR31.671.591.01.25
2025-11-17AMKR30.901.581.71.25
2025-11-18AMKR30.681.592.01.25
2025-11-19AMKR31.431.5109.91.25
2025-11-20AMKR30.181.573.11.25
2025-11-21AMKR32.081.5132.11.25
2025-11-24AMKR33.131.5115.51.25
2025-11-25AMKR33.801.5107.51.25
2025-11-26AMKR34.911.5114.91.25
2025-12-01AMKR37.761.5117.71.25
2025-12-02AMKR40.651.5140.41.25
2025-12-03AMKR43.931.5142.41.25
2025-12-04AMKR43.201.587.61.25
2025-12-05AMKR43.231.597.81.25
2025-12-08AMKR44.711.5- 1.25
DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
19 items Current Page1 of 1




19 items of 1

DateTickerInsider TransactionsInstitutional TransactionsFloat Short
2025-11-10AMKR0.831.135.44
2025-11-11AMKR0.831.135.44
2025-11-12AMKR0.831.136.51
2025-11-13AMKR0.831.136.51
2025-11-14AMKR0.831.136.49
2025-11-17AMKR0.83-0.306.49
2025-11-18AMKR0.83-0.306.49
2025-11-19AMKR0.81-0.306.49
2025-11-20AMKR0.81-0.306.49
2025-11-21AMKR0.81-0.306.49
2025-11-24AMKR0.81-3.496.49
2025-11-25AMKR0.81-3.496.49
2025-11-26AMKR0.81-3.498.87
2025-12-01AMKR0.81-3.588.88
2025-12-02AMKR0.81-3.588.88
2025-12-03AMKR0.81-3.588.88
2025-12-04AMKR0.81-3.588.88
2025-12-05AMKR0.81-3.588.88
2025-12-08AMKR0.81-3.478.88
DateTickerInsider TransactionsInstitutional TransactionsFloat Short
19 items Current Page1 of 1

Last Quarter Act. EPS

0.51

Avg. EPS Est. Current Quarter

0.44

Avg. EPS Est. Next Quarter

0.22

Insider Transactions

0.81

Institutional Transactions

-3.47

Beta

1.99

Average Sales Estimate Current Quarter

1833

Average Sales Estimate Next Quarter

1533

Fair Value

41.12

Quality Score

64

Growth Score

76

Sentiment Score

90

Actual DrawDown %

0.3

Max Drawdown 5-Year %

-65.9

Target Price

36.44

P/E

36.03

Forward P/E

26.87

PEG

2.03

P/S

1.71

P/B

2.57

P/Free Cash Flow

47.95

EPS

1.24

Average EPS Est. Cur. Y​

1.25

EPS Next Y. (Est.)

1.69

Target Price Estimates Raised

1

Target Price Estimates Lowered

Profit Margin

4.77

Relative Volume

1.12

Return on Equity vs Sector %

-45.6

Return on Equity vs Industry %

-38.6

EPS 1 7Days Diff

0.1

EPS 1 30Days Diff

0.13

EBIT Estimation

Amkor Technology, Inc.
Sector: Technology
Industry: Semiconductor Equipment & Materials
Employees: 28300
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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