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IMOS – Chipmos Technologies Inc ADR

ChipMOS TECHNOLOGIES INC.
IMOS
$17.05
Name : ChipMOS TECHNOLOGIES INC.
Sector : Technology
Industry: Semiconductors
Mark. Cap: $629,110,848.00
EPSttm : 1.16
finviz dynamic chart for IMOS
ChipMOS TECHNOLOGIES INC.
$17.05
1.01%
$0.17

Float Short %

0.05

Margin Of Safety %

36

Put/Call OI Ratio

0.02

EPS Next Q Diff

EPS Last/This Y

EPS This/Next Y

Price

17.05

Target Price

22.31

Analyst Recom

3

Performance Q

-9.4

Relative Volume

1.68

Beta

0.93

Ticker: IMOS




22 items of 1

DateSymbolLastP/C OIP/C VolTotal OI
2025-03-04IMOS18.30.110.00249
2025-03-05IMOS18.560.110.00249
2025-03-06IMOS18.270.08999.99329
2025-03-07IMOS18.650.090.00331
2025-03-10IMOS18.060.090.00331
2025-03-11IMOS17.470.090.00331
2025-03-12IMOS18.580.080.00371
2025-03-13IMOS18.330.080.00371
2025-03-14IMOS18.460.080.00371
2025-03-17IMOS18.520.080.00371
2025-03-18IMOS18.540.080.50370
2025-03-19IMOS18.720.080.50370
2025-03-20IMOS18.520.080.50370
2025-03-21IMOS18.290.080.00373
2025-03-24IMOS18.380.080.00373
2025-03-25IMOS17.80.080.00373
2025-03-26IMOS18.360.080.00373
2025-03-27IMOS17.890.080.00373
2025-03-28IMOS17.490.080.00373
2025-03-31IMOS16.770.02999.99315
2025-04-01IMOS16.890.02999.99315
2025-04-02IMOS16.920.02999.99315
DateSymbolLastP/C OIP/C VolTotal OI
22 items Current Page1 of 1




22 items of 1

DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
2025-03-04IMOS18.55- - 0.00
2025-03-05IMOS18.69- - 0.00
2025-03-06IMOS18.49- - 0.00
2025-03-07IMOS18.42- - 0.00
2025-03-10IMOS17.90- - 0.00
2025-03-11IMOS17.45- - 0.00
2025-03-12IMOS18.40- - 0.00
2025-03-13IMOS18.18- - 0.00
2025-03-14IMOS18.32- - 0.00
2025-03-17IMOS18.63- - 0.00
2025-03-18IMOS18.46- - 0.00
2025-03-19IMOS18.80- - 0.00
2025-03-20IMOS18.68- - 0.00
2025-03-21IMOS18.36- - 0.00
2025-03-24IMOS18.46- - 0.00
2025-03-25IMOS18.08- - 0.00
2025-03-26IMOS18.34- - 0.00
2025-03-27IMOS18.35- - 0.00
2025-03-28IMOS17.64- - 0.00
2025-03-31IMOS16.84- - 0.00
2025-04-01IMOS16.88- - 0.00
2025-04-02IMOS17.05- - 0.00
DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
22 items Current Page1 of 1




22 items of 1

DateTickerInsider TransactionsInstitutional TransactionsFloat Short
2025-03-04IMOS0-23.210.10
2025-03-05IMOS0-23.210.10
2025-03-06IMOS0-23.210.10
2025-03-07IMOS0-23.210.10
2025-03-10IMOS0-24.500.10
2025-03-11IMOS0-24.500.10
2025-03-12IMOS0-24.500.08
2025-03-13IMOS0-24.500.08
2025-03-14IMOS0-24.500.08
2025-03-17IMOS0-23.690.08
2025-03-18IMOS0-23.690.08
2025-03-19IMOS0-23.690.08
2025-03-20IMOS0-23.690.08
2025-03-21IMOS0-23.690.08
2025-03-24IMOS0-28.570.08
2025-03-25IMOS0-28.570.08
2025-03-26IMOS0-28.570.05
2025-03-27IMOS0-28.570.05
2025-03-28IMOS0-28.570.05
2025-03-31IMOS0-36.950.05
2025-04-01IMOS0-36.950.05
2025-04-02IMOS0-36.950.05
DateTickerInsider TransactionsInstitutional TransactionsFloat Short
22 items Current Page1 of 1

Last Quarter Act. EPS

Avg. EPS Est. Current Quarter

Avg. EPS Est. Next Quarter

Insider Transactions

Institutional Transactions

-36.95

Beta

0.93

Average Sales Estimate Current Quarter

5262

Average Sales Estimate Next Quarter

5264

Fair Value

23.25

Quality Score

59

Growth Score

69

Sentiment Score

8

Actual DrawDown %

61.9

Max Drawdown 5-Year %

-62.1

Target Price

22.31

P/E

14.08

Forward P/E

10.67

PEG

P/S

0.88

P/B

0.81

P/Free Cash Flow

23.75

EPS

1.21

Average EPS Est. Cur. Y​

EPS Next Y. (Est.)

Target Price Estimates Raised

Target Price Estimates Lowered

Profit Margin

6.27

Relative Volume

1.68

Return on Equity vs Sector %

-44.9

Return on Equity vs Industry %

-49.9

EPS 1 7Days Diff

EPS 1 30Days Diff

EBIT Estimation

ChipMOS TECHNOLOGIES INC.
Sector: Technology
Industry: Semiconductors
Employees:
ChipMOS TECHNOLOGIES INC. research, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, Japan, People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, LCDD, Bumping and others. It offers a range of back-end testing services for high density memory, mixed-signal and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, mixed signal and Display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips still in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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