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AMKR – Amkor Technology, Inc.

Float Short %

6.17

Margin Of Safety %

24

Put/Call OI Ratio

1.65

EPS Next Q Diff

0.18

EPS Last/This Y

-0.31

EPS This/Next Y

0.38

Price

25.45

Target Price

24.88

Analyst Recom

2.42

Performance Q

24.87

Relative Volume

0.8

Beta

1.96

Ticker: AMKR




20 items of 1

DateSymbolLastP/C OIP/C VolTotal OI
2025-08-15AMKR23.774.110.03112309
2025-08-18AMKR24.051.980.1860119
2025-08-19AMKR23.741.970.2660232
2025-08-20AMKR231.970.4360310
2025-08-21AMKR23.221.960.3960402
2025-08-22AMKR24.091.960.1960447
2025-08-25AMKR24.151.950.1360615
2025-08-26AMKR24.361.950.0960638
2025-08-27AMKR24.591.941.5560752
2025-08-28AMKR24.671.950.2661178
2025-08-29AMKR24.191.940.3961331
2025-09-02AMKR23.911.930.3661444
2025-09-03AMKR23.81.980.2060927
2025-09-04AMKR24.31.960.2661119
2025-09-05AMKR24.651.960.0961108
2025-09-08AMKR24.831.940.1461443
2025-09-09AMKR24.881.930.0261624
2025-09-10AMKR24.781.630.1165479
2025-09-11AMKR25.391.650.1165304
2025-09-12AMKR25.461.650.0365528
DateSymbolLastP/C OIP/C VolTotal OI
20 items Current Page1 of 1




20 items of 1

DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
2025-08-15AMKR23.76-12.3-79.81.13
2025-08-18AMKR24.05-12.3-62.21.13
2025-08-19AMKR23.74-12.3-72.41.13
2025-08-20AMKR23.00-12.3-79.81.13
2025-08-21AMKR23.22-12.3-63.31.13
2025-08-22AMKR24.08-12.3-51.71.13
2025-08-25AMKR24.15-12.3-66.11.13
2025-08-26AMKR24.36-12.3-63.61.13
2025-08-27AMKR24.57-12.3-63.61.13
2025-08-28AMKR24.66-12.3-65.81.13
2025-08-29AMKR24.16-12.3-75.41.13
2025-09-02AMKR23.92-12.3-71.71.13
2025-09-03AMKR23.81-12.3193.91.13
2025-09-04AMKR24.30-12.3208.71.13
2025-09-05AMKR24.64-12.3208.91.13
2025-09-08AMKR24.83-12.3204.31.13
2025-09-09AMKR24.88-12.3200.21.13
2025-09-10AMKR24.79-12.3196.81.13
2025-09-11AMKR25.38-12.3215.41.13
2025-09-12AMKR25.45-12.3201.01.13
DateTickerPriceCurrent Quarter Growth EstimateEBIT EstimationAverage EPS Estimate Current Year
20 items Current Page1 of 1




20 items of 1

DateTickerInsider TransactionsInstitutional TransactionsFloat Short
2025-08-15AMKR2.59-2.637.27
2025-08-18AMKR2.59-4.657.27
2025-08-19AMKR2.59-4.657.27
2025-08-20AMKR2.59-4.657.27
2025-08-21AMKR2.59-4.657.27
2025-08-22AMKR2.59-4.657.27
2025-08-25AMKR2.593.407.27
2025-08-26AMKR2.593.407.27
2025-08-27AMKR0.853.406.16
2025-08-28AMKR0.853.406.16
2025-08-29AMKR0.853.406.16
2025-09-02AMKR0.853.516.16
2025-09-03AMKR0.853.516.16
2025-09-04AMKR0.853.516.16
2025-09-05AMKR0.853.516.16
2025-09-08AMKR0.853.586.16
2025-09-09AMKR0.853.586.16
2025-09-10AMKR0.843.586.16
2025-09-11AMKR0.843.586.17
2025-09-12AMKR0.843.586.17
DateTickerInsider TransactionsInstitutional TransactionsFloat Short
20 items Current Page1 of 1

Last Quarter Act. EPS

0.22

Avg. EPS Est. Current Quarter

0.43

Avg. EPS Est. Next Quarter

0.4

Insider Transactions

0.84

Institutional Transactions

3.58

Beta

1.96

Average Sales Estimate Current Quarter

1923

Average Sales Estimate Next Quarter

1814

Fair Value

31.46

Quality Score

66

Growth Score

73

Sentiment Score

91

Actual DrawDown %

43.3

Max Drawdown 5-Year %

-65.9

Target Price

24.88

P/E

20.78

Forward P/E

16.67

PEG

1.72

P/S

1

P/B

1.5

P/Free Cash Flow

22.71

EPS

1.23

Average EPS Est. Cur. Y​

1.13

EPS Next Y. (Est.)

1.51

Target Price Estimates Raised

Target Price Estimates Lowered

Profit Margin

4.8

Relative Volume

0.8

Return on Equity vs Sector %

-42.4

Return on Equity vs Industry %

-42.7

EPS 1 7Days Diff

EPS 1 30Days Diff

EBIT Estimation

201
Amkor Technology, Inc.
Sector: Technology
Industry: Semiconductor Equipment & Materials
Employees: 28300
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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